Thin small outline package explained

Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.

TSOP is the smallest leaded form factor for flash memory.^[1]

History

The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card.^[2]

Physical properties

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages.^[3]

Type I

width=80	Part number	width=50	Pins	width=80	Body width (mm)	width=80	Body length (mm)	width=80	Lead pitch (mm)
TSOP28	28	8.1	11.8	0.55
TSOP28/32	28/32	8	18.4	0.5
TSOP40	40	10	18.4	0.5
TSOP48	48	1	18.4	0.5
TSOP56	56	14	18.4	0.5

Type II

width=80	Part number	width=50	Pins	width=80	Body width (mm)	width=80	Body length (mm)	width=80	Lead pitch (mm)
TSOP6 (SOT457)^[4]	6	1.5	2.9	0.95
TSOP20/24/26	20/24/26	7.6	17.14	1.27
TSOP24/28	24/28	10.16	18.41	1.27
TSOP32	32	10.16	20.95	1.27
TSOP40/44	40/44	10.16	18.42	0.8
TSOP50	50	10.16	20.95	0.8
TSOP54	54	10.16	22.22	0.8
TSOP66	66	10.16	22.22	0.65

HTSOP

HTSOP (Heatsink TSOP) is a variant of TSOP with an exposed pad on the bottom side. The pad is soldered to the PCB to transfer heat from the package to the PCB.

Similar packages

There are a variety of small form-factor IC carrier available other than TSOPs

• Small-outline integrated circuit (SOIC)
• Plastic small-outline package (PSOP)
• Shrink small-outline package (SSOP)
• Thin-shrink small outline package (TSSOP)

See also

• Integrated circuit
• Chip carrier Chip packaging and package types list

External links

• TSOP Package Information from Amkor Technology

Notes and References

1. Web site: Small Outline Package Guide . Intel . 1-1 . 1999 . December 17, 2021 . dead . https://web.archive.org/web/20170211223522/http://glacier.lbl.gov/~gtp/DOM/dataSheets/Intel_Packaging.pdf . February 11, 2017 .
2. Texas Instruments."Recent Advancements in Bus-Interface Packaging and Processing".1997.p. 2
3. http://www.siliconfareast.com/tsop.htm SiliconFarEast: "TSOP - Thin Small Outline Package"
4. Web site: Sc-74; Tsop6 (Sot457) .