TO-66 explained

TO-66 should not be confused with 1996 TO66.

TO-66 is a type of semiconductor package for devices with three connections, such as transistors. The shape is similar to the TO-3 package, but the size is smaller. The TO-66 package is made entirely of metal and is commonly used by silicon controlled rectifiers and power transistors.[1] In Europe, it was popularly used by the complementary germanium power transistors AD161/AD162.

The TO-66 package consists of a diamond-shaped base plate with diagonals of 31.4mm and 19mm. The plate has two mounting holes on the long diagonal, with the centers spaced 23mm apart. A cap attached to one side of the plate and under which the semiconductor chip is located, brings the total height to up to 8.63mm. Two pins on the other side of the plate are isolated from the package by individual glass-metal seals. The metal case forms the third connection (in the case of a bipolar junction transistor this is typically the collector).

Variants

TO-66 is often used as a synonym for any of the variants that have the same footprint (i.e. position of mounting holes and pins) as TO-66.

TO-123

TO-123 reduces the maximum thickness of the base plate from 1.9mm to 1.02mm.[2]

TO-124

TO-124 increases the maximum thickness of the base plate from 1.9mm to 2.59mm and the maximum total height from 8.63mm to 9.02mm.[3]

TO-213

TO-213 is intended to replace previous definitions of flange-mounted packages with a 5.08mm pin spacing.[4] The different outlines are now defined as variants of TO-213: TO-66 is renamed to TO-213-AA, TO-123 to TO-213-AB, TO-124 to TO-213-AC.

National standards

Standards organizationStandardDesignation for
TO-66TO-123TO-124
JEDECJEP95TO-213-AATO-213-ABTO-213-AC
IECIEC 60191[5] C13/B16
EIAJ / JEITAED-7500A[6] TC-16A/TB-12TC-9/TB-12
British StandardsBS 3934[7] SO-55/SB2-5
GosstandartGOST 18472—88[8] KT-8
RosstandartGOST R 57439[9]
Kombinat Mikroelektronik ErfurtTGL 11811[10] D
TGL 26713/11L2B

See also

External links

Notes and References

  1. Web site: TO-66 Package . EESemi.com . 8 February 2019.
  2. Web site: TO-123 . https://web.archive.org/web/20160410042016/http://www.jedec.org/sites/default/files/docs/archive/to/to-123.pdf . 2016-04-10 . JEDEC . 2021-06-28.
  3. Web site: TO-124 . https://web.archive.org/web/20160405021043/http://www.jedec.org/sites/default/files/docs/archive/to/to-124.pdf . 2016-04-05 . JEDEC . 2021-06-28.
  4. Book: JEDEC Publication No. 95 . registration . Flange Mounted Header Family 0.200 Pin Spacing . JEDEC . 200-201 . September 1976 . 2021-07-13.
  5. Web site: Semiconductors . . 1978 . 215 . 2021-06-17.
  6. Web site: EIAJ ED-7500A Standards for the Dimensions of Semiconductor Devices . JEITA . 1996 . 2021-06-14.
  7. Web site: Mullard Technical Handbook Book 1 Part 1 . Mullard . 1974 . 142 . 2021-06-14.
  8. Web site: ГОСТ 18472—88 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры . GOST 18472—88 Semiconductor devices - basic dimensions . ru . Rosstandart . 1988 . 41 . 2021-06-17.
  9. Web site: ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры . Semiconductor devices - basic dimensions . ru . Rosstandart . 2017 . 50-51 . 2021-06-17.
  10. Web site: TGL 26713/11: Gehäuse für Halbleiterbauelemente - Bauform L . Verlag für Standardisierung . Leipzig . June 1988 . de . 2021-06-15.