Winbond Explained

Winbond Electronics Corporation
華邦電子公司
Type:Corporation
Location:Taichung, Taiwan
Key People:Arthur Yu-Cheng Chiao
(Chairman & CEO)
Tung-Yi Chan
(President)
Industry:Semiconductors

Winbond Electronics Corporation is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.

Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.

History

Winbond was established in 1987 in Hsinchu Science Park in Taiwan.[1] [2] Its founder came from the Industrial Technology Research Institute.[3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant.[4]

In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers.[5]

Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995.[6]

Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing.[7] By 2002 Winbond had 4,000 employees. In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees.[8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM.[9]

The computer IC, consumer electronics IC, and logic product foundry divisions of Winbond were spun off as Nuvoton Technology Corporation on 1 July 2008.

In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda.[10]

In 2019 Karamba Security partnered with Winbond to make secure embedded flash products.[11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium.[12]

See also

Notes and References

  1. Book: Saperstein . Jeff . Creating Regional Wealth in the Innovation Economy: Models, Perspectives, and Best Practices . Rouach . Daniel . 2002 . FT Press . 978-0-13-065415-1 . 225 . en.
  2. Book: Jennex, Murray E. . Knowledge Management: Concepts, Methodologies, Tools, and Applications . IGI Global . 2008 . 978-1-59904-934-2 . en.
  3. Book: Misa . Thomas J. . Modernity and Technology . Brey . Philip . Feenberg . Andrew . 2003 . MIT Press . 978-0-262-63310-9 . 350 . en.
  4. Book: Pan, Joshua Jih . J.J. Pan and Partners: Selected and Current Works . 1999 . Images Publishing . 978-1-86470-058-9 . 210–211 . en.
  5. News: Corcoran . Cate . 1992-07-27 . Winbond gives HP another notch in its PA-RISC belt . 2024-05-15 . InfoWorld . 30.
  6. LaPedus . Mark . October 30, 1995 . Winbond Plays It Out With Symphony . Electronic Buyers' News . CMP Publications . 3 . ProQuest.
  7. News: Tran . Mark . 1999-09-21 . China offers aid after Taiwan quake . 2024-05-15 . The Guardian . en-GB . 0261-3077.
  8. Book: Gupta . Jatinder N. D. . Creating Knowledge Based Organizations . Sharma . Sushil Kumar . 2004-01-01 . Idea Group Inc (IGI) . 978-1-59140-162-9 . 291 . en.
  9. Book: Png, Ivan . Managerial Economics, 4th Edition . 2013-09-11 . Routledge . 978-1-136-29757-1 . en.
  10. News: 2010-08-12 . Winbond's innovative DRAM design and the legacy of Qimonda . 2024-05-15 . EDN.
  11. Web site: Lynn . Alex . 2019-12-02 . Winbond and Karamba Security partner for embedded cyber security . 2024-05-15 . www.electronicspecifier.com . en.
  12. Web site: Fowle . Harry . 2023-02-17 . Winbond joins UCIe Consortium to support chiplet interface standardisation . 2024-05-15 . www.electronicspecifier.com . en.