| Winbond Electronics Corporation 華邦電子公司 | |
| Type: | Corporation |
| Location: | Taichung, Taiwan |
| Key People: | Arthur Yu-Cheng Chiao (Chairman & CEO) Tung-Yi Chan (President) |
| Industry: | Semiconductors |
Winbond Electronics Corporation is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.
Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.
Winbond was established in 1987 in Hsinchu Science Park in Taiwan.[1] [2] Its founder came from the Industrial Technology Research Institute.[3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant.[4]
In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers.[5]
Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995.[6]
Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing.[7] By 2002 Winbond had 4,000 employees. In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees.[8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM.[9]
The computer IC, consumer electronics IC, and logic product foundry divisions of Winbond were spun off as Nuvoton Technology Corporation on 1 July 2008.
In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda.[10]
In 2019 Karamba Security partnered with Winbond to make secure embedded flash products.[11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium.[12]