Multi-leaded power package explained

The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W.

One well-known STMicroelectronics brand of this type of package is Multiwatt.[1]

Typical applications

Multi-leaded power packages are heatsinkable, and thus can be used in projects where a large amount of power is being drawn. The top of the package has a metal tab with a hole used in mounting the component to a heatsink. Thermal compound is also used to provide greater heat transfer.

The metal tab is often connected electrically to the internal circuitry; ground and supply connections are common. This does not normally pose a problem when using isolated heatsinks, but an electrically-insulating pad or sheet may be required to electrically isolate the component from the heatsink if the heatsink is grounded or otherwise non-isolated. The material used to electrically isolate the multi-leaded power package, like mica, needs to have a high thermal conductivity.

In applications where vertical clearance is at a premium (such as ISA cards in computers), it is often feasible to bend the leads at a right angle and mount the component flat to the printed wiring board using a screw and nut. This often provides enough surface area to heatsink the component when power dissipation is moderately high.

References

  1. Web site: AN261 Designing with Thermal Impedance . Hopkins . T. . Cognetti . C. . Tiziani . R. . . 1988 . live . https://web.archive.org/web/20171223111402/http://www.st.com/content/ccc/resource/technical/document/application_note/4e/1d/dc/1f/d3/1e/44/4b/CD00003784.pdf/files/CD00003784.pdf/jcr:content/translations/en.CD00003784.pdf . 2017-12-23 .