List of Intel Core processors explained

The following is a list of Intel Core processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7), Core 3-, Core 5-, and Core 7-branded processors.

Desktop processors

Core 2

See main article: Intel Core 2.

"Allendale" (65 nm, 800 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• Die size: 111 mm²
• Steppings: L2, M0, G0

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• All models support: Intel VT-x
• Die size: 143 mm²
• Steppings: B2, G0

Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).^[1]

Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.^[2]

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• All models support: Intel VT-x
• All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 143 mm²
• Transistor count: 291 million
• Steppings: B2, G0

Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 111 mm² (Conroe)
• Steppings: ?

"Conroe XE" (65 nm)

^{[3] [4]}

These models feature an unlocked clock multiplier

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 143 mm²
• Steppings: B1, B2
• The X6900 was never publicly released.

"Kentsfield" (65 nm)

^{[5] [6]}

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• Die size: 2 ×143 mm²
• Steppings: B3, G0

"Kentsfield XE" (65 nm)

^[7]

These models feature an unlocked clock multiplier

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• Die size: 2 ×143 mm²
• Steppings: B3, G0

"Wolfdale-3M" (45 nm, 1066 MT/s)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• Die size: 82 mm²
• Transistor Count: 230 million
• Steppings: M0, R0
• Models with a part number ending in "ML" instead of "M" support Intel VT-x

"Wolfdale" (45 nm, 1333 MT/s)

• All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
• Die size: 107 mm²
• Transistor Count: 410 million
• Steppings: C0, E0

Note: The E8190 and E8290 do not support Intel VT-d.

Note 2: E8700 is a very rare example in Intel's history where a model was yanked from Intel ARK without a recall notice and after a SSPEC was assigned. Working examples were seen, believed to have been released to OEM^[8], but none was offered in retail PCs.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
• Die size: 2 × 82 mm²
• Steppings: M0, M1, R0
• All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.

Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
• Die size: 2 × 107 mm²
• The "S" suffix denotes to low power consumption specs with 65W TDP, equivalent to that of a standard Core 2 Duo. Supplied to OEM channels only and mostly seen as options for SFF platforms. The first batch of Q9550S has no "S" marking on lid, thus only differentiated by SSPEC.
• Steppings: C0, C1, E0

"Yorkfield XE" (45 nm)

• These models feature an unlocked clock multiplier
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
• Intel VT-d supported by: QX9650^[9]
• Die size: 2 × 107 mm²
• Steppings: C0, C1, E0
• The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.^{[10] [11] [12]}

Core i (1st gen)

Lynnfield

Common features:

• Socket: LGA 1156.
• All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 45 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	880	4 (8)	3.06	3.73	8 MB	95 W		US $583
	875K		2.93	3.60				US $342
	870							US $562
	870S		2.67			82 W		US $351
	860		2.80	3.46		95 W		US $284
	860S		2.53			82 W		US $337
Core i5	760	4 (4)	2.80	3.33		95 W		US $205
	750		2.66	3.20				US $196
	750S		2.40			82 W		US $259

Bloomfield

Common features:

• Socket: LGA 1366.
• All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
• PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
• All CPUs feature a QPI bus to the chipset (northbridge).
  • Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 45 nm.
• Extreme Edition processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	975 Extreme Edition	4 (8)	3.33	3.60	8 MB	130 W		US $999
	965 Extreme Edition		3.20	3.46
	960							US $562
	950		3.06	3.33
	940		2.93	3.20
	930		2.80	3.06				US $294
	920		2.66	2.93				US $284

Clarkdale

Common features:

• Socket: LGA 1156.
• All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i5	680	2 (4)	3.60	3.86	HD Graphics	733	4 MB	73 W		US $294
	670		3.46	3.73						US $284
	661		3.33	3.60		900		87 W		US $196
	660					733		73 W
	655K		3.20	3.46						US $216
	650									US $176
Core i3	560		3.33						US $138
	550		3.20
	540		3.06						US $133
	530		2.93						US $113

Gulftown

Common features:

• Socket: LGA 1366.
• All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
• PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
• All CPUs feature a QPI bus to the chipset (northbridge).
  • Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	990X	6 (12)	3.46	3.73	12 MB	130 W		US $999
	980X		3.33	3.60
	980							US $583
	970		3.20	3.46				US $885

Core i (2nd gen)

Sandy Bridge-DT

Common features:

• Socket: LGA 1155.
• All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i3-2120, i5-2400, and i7-2600 are available as embedded processors.
• The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	2700K	4 (8)	3.5	3.9	HD 3000	850–1350	8 MB	95 W		US $332
	2600K		3.4	3.8						US $317
	2600				HD 2000					US $294
	2600S		2.8					65 W		US $306
Core i5	2550K	4 (4)	3.4		6 MB	95 W		US $225
	2500K		3.3	3.7	HD 3000		850–1100		US $216
	2500				HD 2000				US $205
	2500S		2.7			65 W			US $216
	2500T		2.3	3.3		650–1250	45 W
	2450P		3.2	3.5	95 W		US $195
	2400		3.1	3.4	HD 2000	850–1100		US $184
	2405S		2.5	3.3	HD 3000		65 W		US $205
	2400S				HD 2000				US $195
	2390T	2 (4)	2.7	3.5		650–1100	3 MB	35 W
	2380P	4 (4)	3.1	3.4	6 MB	95 W		US $177
	2320		3.0	3.3	HD 2000		850–1100
	2310		2.9	3.2
	2300		2.8	3.1
Core i3	2130	2 (4)	3.4	850–1100		3 MB	65 W		US $138
	2125		3.3	HD 3000	US $134
	2120			HD 2000				US $138
	2120T		2.6				650–1100	35 W	US $127
	2105		3.1	HD 3000	850–1100		65 W		US $134
	2102			HD 2000				Q2 2011	US $127
	2100								US $117
	2100T		2.5		650–1100		35 W		US $127

Core i (3rd gen)

Ivy Bridge-DT

Common features:

• Socket: LGA 1155.
• All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i3-3220, i5-3550S and i7-3770 are available as embedded processors.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	3770K	4 (8)	3.5	3.9	HD 4000	650–1150	8 MB	77 W		US $342
	3770		3.4							US $305
	3770S		3.1					65 W		US $305
	3770T		2.5	3.7				45 W		US $294
Core i5	3570K	4 (4)	3.4	3.8			6 MB	77 W		US $225
	3570				HD 2500					US $205
	3570S		3.1					65 W
	3570T		2.3	3.3				45 W
	3550		3.3	3.7				77 W
	3550S		3.0					65 W
	3470		3.2	3.6		650–1100		77 W		US $184
	3475S		2.9		HD 4000			65 W		US $201
	3470S				HD 2500					US $184
	3470T	2 (4)					3 MB	35 W
	3450	4 (4)	3.1	3.5			6 MB	77 W
	3450S		2.8					65 W
	3350P		3.1	3.3	69 W				US $177
	3340				HD 2500	650–1050		77 W		US $182
	3340S		2.8					65 W
	3330		3.0	3.2				77 W
	3335S		2.7		HD 4000			65 W		US $194
	3330S				HD 2500					US $177
Core i3	3250	2 (4)	3.5	3 MB			55 W		US $138
	3250T		3.0	35 W
	3245		3.4	HD 4000	55 W		US $134
	3240			HD 2500				US $138
	3240T		2.9		35 W
	3225		3.3	HD 4000	55 W			US $134
	3220			HD 2500				US $117
	3220T		2.8		35 W
	3210		3.2		55 W

Sandy Bridge-E

Common features:

• Socket: LGA 2011.
• All the CPUs support quad-channel DDR3-1600 RAM.
• All CPU models provide 40 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	3970X	6 (12)	3.5	4.0	15 MB	150 W		US $999
	3960X		3.3	3.9		130 W
	3930K		3.2	3.8	12 MB			US $583
	3820	4 (8)	3.6	3.8	10 MB			US $294

Core i (4th gen)

Haswell-DT

Common features:

• Socket: LGA 1150.
• All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	4790K	4 (8)	4.0	4.4	HD 4600	350–1250	8 MB	88 W		US $350
	4790		3.6	4.0		350–1200		84 W		US $312
	4790S		3.2					65 W
	4790T		2.7	3.9				45 W		US $303
	4785T		2.2	3.2				35 W
	4770K		3.5	3.9		350–1250		84 W		US $350
	4771					350–1200				US $320
	4770		3.4							US $312
	4770S		3.1					65 W		US $305
	4770T		2.5	3.7				45 W		US $303
	4765T		2.0	3.0				35 W
Core i5	4690K	4 (4)	3.5	3.9			6 MB	88 W		US $242
	4690							84 W		US $213
	4690S		3.2					65 W
	4690T		2.5	3.5				45 W
	4670K		3.4	3.8				84 W		US $242
	4670									US $213
	4670S		3.1					65 W
	4670T		2.3	3.3				45 W
	4590		3.3	3.7		350–1150		84 W		US $192
	4590S		3.0					65 W
	4590T		2.0	3.0				35 W
	4570		3.2	3.6				84 W
	4570S		2.9					65 W
	4570T	2 (4)				200–1150	4 MB	35 W
	4470	4 (4)	3.3	3.5		350–1100	6 MB	84 W
	4460		3.2	3.4						US $182
	4460S		2.9					65 W
	4460T		1.9	2.7				35 W
	4440		3.1	3.3				84 W
	4440S		2.8					65 W
	4430		3.0	3.2				84 W
	4430S		2.7					65 W
Core i3	4370	2 (4)	3.8	350–1150		4 MB	54 W		US $149
	4370T		3.3				200–1150	35 W		US $138
	4360		3.7				350–1150	54 W		US $149
	4360T		3.2				200–1150	35 W		US $138
	4350		3.6				350–1150	54 W
	4350T		3.1				200–1150	35 W
	4340		3.6				350–1150	54 W		US $149
	4330		3.5							US $138
	4330T		3.0				200–1150	35 W
	4170		3.7		HD 4400	350–1150	3 MB	54 W		US $117
	4170T		3.2			200–1150		35 W
	4160		3.6			350–1150		54 W
	4160T		3.1			200–1150		35 W
	4150		3.5			350–1150		54 W
	4150T		3.0			200–1150		35 W
	4130		3.4			350–1150		54 W		US $122
	4130T		2.9			200–1150		35 W

Haswell-H

Common features:

• Socket: BGA 1364 (soldered).
• All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4770R	4 (8)	3.2	3.9	Iris Pro 5200	200–1300	6 MB	65 W
Core i5	4670R	4 (4)	3.0	3.7			4 MB
	4570R		2.7	3.2		200–1150

Ivy Bridge-E

Common features:

• Socket: LGA 2011.
• All the CPUs support quad-channel DDR3-1866 RAM.
• All CPU models provide 40 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	4960X	6 (12)	3.6	4.0	15 MB	130 W		US $990
	4930K		3.4	3.9	12 MB			US $555
	4820K	4 (8)	3.7		10 MB			US $310

Core i (5th gen)

Broadwell-H

Common features:

• Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
• All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	5775R	4 (8)	3.3	3.8	Iris Pro 6200	300–1150	6 MB	65 W
	5775C			3.7						US $366
Core i5	5675R	4 (4)	3.1	3.6		300–1100	4 MB
	5675C									US $276
	5575R		2.8	3.3		300–1050

Haswell-E

Common features:

• Socket: LGA 2011-3.
• All the CPUs support quad-channel DDR4-2133 RAM.
• i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	5960X	8 (16)	3.0	3.5	20 MB	140 W		US $999
	5930K	6 (12)	3.5	3.7	15 MB			US $583
	5820K		3.3	3.6				US $389

Core i (6th gen)

Skylake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	6700K	4 (8)	4.0	4.2	HD 530	350–1150	8 MB	91 W		US $339
	6700		3.4	4.0				65 W		US $303
	6700T		2.8	3.6		350–1100		35 W
Core i5	6600K	4 (4)	3.5	3.9		350–1150	6 MB	91 W		US $243
	6600		3.3					65 W		US $213
	6600T		2.7	3.5		350–1100		35 W
	6500		3.2	3.6		350–1050		65 W		US $192
	6500T		2.5	3.1		350–1100		35 W
	6402P		2.8	3.4	HD 510	350–950		65 W		US $182
	6400		2.7	3.3	HD 530
	6400T		2.2	2.8				35 W
Core i3	6320	2 (4)	3.9	350–1150		4 MB	51 W	US $148
	6300		3.8	US $139
	6300T		3.3	350–950			35 W	US $138
	6100		3.7	350–1050		3 MB	51 W	US $117
	6100T		3.2	350–950			35 W
	6098P		3.6	HD 510	350–1050		54 W

Skylake-H

Common features:

• Socket: BGA 1440 (soldered).
• All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6785R	4 (8)	3.3	3.9	Iris Pro 580	350–1150	8 MB	65 W
Core i5	6685R	4 (4)	3.2	3.8			6 MB
	6585R		2.8	3.6		350–1100

Broadwell-E

Common features:

• Socket: LGA 2011-3.
• All the CPUs support quad-channel DDR4-2400 RAM.
• i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	6950X	10 (20)	3.0	3.5	25 MB	140 W		US $1723
	6900K	8 (16)	3.2	3.7	20 MB			US $1089
	6850K	6 (12)	3.6	3.8	15 MB			US $617
	6800K		3.4					US $434

Core i (7th gen)

Kaby Lake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	7700K	4 (8)	4.2	4.5	HD 630	350–1150	8 MB	91 W		US $339
	7700		3.6	4.2				65 W		US $303
	7700T		2.9	3.8				35 W
Core i5	7600K	4 (4)	3.8	4.2			6 MB	91 W		US $242
	7600		3.5	4.1				65 W		US $213
	7600T		2.8	3.7		350–1100		35 W
	7500		3.4	3.8				65 W		US $192
	7500T		2.7	3.3				35 W
	7400		3.0	3.5		350–1000		65 W		US $182
	7400T		2.4	3.0				35 W
Core i3	7350K	2 (4)	4.2	350–1150		4 MB	60 W	US $168
	7320		4.1	51 W			US $157
	7300		4.0				US $147
	7300T		3.5	350–1100				35 W
	7100		3.9			3 MB	51 W	US $117
	7100T		3.4				35 W

Skylake-X

Common features:

• Socket: LGA 2066.
• All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
• i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Smart Cache	TDP	Release date	MSRP
			Base	Turbo 2.0	Turbo 3.0
Core i9	7980XE	18 (36)	2.6	4.2	4.4	24.75 MB	165 W		US $1999
	7960X	16 (32)	2.8			22 MB			US $1699
	7940X	14 (28)	3.1	4.3		19.25 MB			US $1399
	7920X	12 (24)	2.9			16.5 MB	140 W		US $1199
	7900X	10 (20)	3.3		4.5	13.75 MB			US $989
Core i7	7820X	8 (16)	3.6			11 MB			US $599
	7800X	6 (12)	3.5	4.0		8.25 MB			US $389

Kaby Lake-X

Common features:

• Socket: LGA 2066.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date	MSRP
			Base	Turbo
Core i7	7740X	4 (8)	4.3	4.5	8 MB	112 W		US $339
Core i5	7640X	4 (4)	4.0	4.2	6 MB			US $242

Core i (8th gen)

Coffee Lake-S

Common features:

• Socket: LGA 1151-2.
• All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i7	8086K	6 (12)	4.0	5.0	UHD 630	350–1200	12 MB	95 W		US $425
	8700K		3.7	4.7						US $359
	8700		3.2	4.6				65 W		US $303
	8700T		2.4	4.0				35 W
Core i5	8600K	6 (6)	3.6	4.3		350–1150	9 MB	95 W		US $257
	8600		3.1					65 W		US $213
	8600T		2.3	3.7				35 W
	8500		3.0	4.1		350–1100		65 W		US $192
	8500T		2.1	3.5				35 W
	8400		2.8	4.0		350–1050		65 W		US $182
	8400T		1.7	3.3				35 W
Core i3	8350K	4 (4)	4.0	350–1150		8 MB	91 W		US $168
	8300		3.7	62 W				US $138
	8300T		3.2	350–1100					35 W
	8100		3.6			6 MB	65 W		US $117
	8100F
	8100T		3.1	UHD 630	350–1100		35 W

Core i (9th gen)

Coffee Lake-R

Common features:

• Socket: LGA 1151-2.
• All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9-9900KS has all-core boost clock of 5.0 GHz.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i9	9900KS	8 (16)	4.0	5.0	UHD 630	350–1200	16 MB	127 W		US $524
	9900K		3.6					95 W		US $488
	9900KF								US $463
	9900		3.1		UHD 630	350–1200		65 W		US $439
	9900T		2.1	4.4				35 W
Core i7	9700K	8 (8)	3.6	4.9			12 MB	95 W		US $374
	9700KF
	9700		3.0	4.7	UHD 630	350–1200		65 W		US $323
	9700F				colspan="2"
	9700T		2.0	4.3	UHD 630	350–1200		35 W
Core i5	9600K	6 (6)	3.7	4.6		350–1150	9 MB	95 W		US $262
	9600KF								US $263
	9600		3.1		UHD 630	350–1150		65 W		US $213
	9600T		2.3	3.9				35 W
	9500		3.0	4.2		350–1100		65 W		US $192
	9500F				colspan="2"
	9500T		2.2	3.7	UHD 630	350–1100		35 W
	9400		2.9	4.1		350–1050		65 W		US $182
	9400F				colspan="2"
	9400T		1.8	3.4	UHD 630	350–1050		35 W
Core i3	9350K	4 (4)	4.0	4.6		350–1150	8 MB	91 W		US $173
	9350KF
	9320		3.7	4.4	UHD 630	350–1150		62 W		US $154
	9300			4.3						US $143
	9300T		3.2	3.8		350–1100		35 W
	9100		3.6	4.2			6 MB	65 W		US $122
	9100F				colspan="2"
	9100T		3.1	3.7	UHD 630	350–1100		35 W

Skylake-X (9xxx)

Common features:

• Socket: LGA 2066.
• All the CPUs support quad-channel DDR4-2666 RAM.
• All CPU models provide 44 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Smart Cache	TDP	Release date	MSRP
			Base	Turbo 2.0	Turbo 3.0
Core i9	9990XE^[13]	14 (28)	4.0	5.0	5.0	19.25 MB	255 W
	9980XE	18 (36)	3.0	4.4	4.5	24.75 MB	165 W	Q4 2018	US $1979
	9960X	16 (32)	3.1			22 MB			US $1684
	9940X	14 (28)	3.3			19.25 MB			US $1387
	9920X	12 (24)	3.5						US $1189
	9900X	10 (20)							US $989
	9820X		3.3	4.1	4.2	16.5 MB			US $889
Core i7	9800X	8 (16)	3.8	4.4	4.5				US $589

Core i (10th gen)

Comet Lake-S

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo		Model	Clock (MHz)
Core i9	10900K	10 (20)	3.7	5.2	5.3	UHD 630	350–1200	20 MB	125 W		US $488
	10900KF					US $472
	10910		3.6	5.0		UHD 630	350–1200			Q3 2020
	10900		2.8	5.1	5.2				65 W		US $439
	10900F					US $422
	10900T		1.9	4.6		UHD 630	350–1200		35 W		US $439
	10850K		3.6	5.1	5.2				125 W		US $453
Core i7	10700K	8 (16)	3.8	5.1	16 MB					US $374
	10700KF				US $349
	10700		2.9	4.8	UHD 630	350–1200	65 W		US $323
	10700F				US $298
	10700T		2.0	4.5	UHD 630	350–1200	35 W		US $325
Core i5	10600K	6 (12)	4.1	4.8			12 MB	125 W		US $262
	10600KF				US $237
	10600		3.3		UHD 630	350–1200		65 W		US $213
	10600T		2.4	4.0				35 W
	10500		3.1	4.5		350–1150		65 W		US $192
	10500T		2.3	3.8				35 W
	10400		2.9	4.3		350–1100		65 W		US $182
	10400F				US $157
	10400T		2.0	3.6	UHD 630	350–1100		35 W		US $182
Core i3	10320	4 (8)	3.8	4.6		350–1150	8 MB	65 W		US $154
	10300		3.7	4.4						US $143
	10300T		3.0	3.9		350–1100		35 W
	10100		3.6	4.3			6 MB	65 W		US $122
	10100F								US $97
	10100T		3.0	3.8	UHD 630	350–1100		35 W		US $122

Comet Lake-S (refresh)

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• All models support Turbo Boost 2.0.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo	Model	Clock (MHz)
Core i5	10505	6 (12)	3.2	4.6	UHD 630	350–1200	12 MB	65 W		US $192
Core i3	10325	4 (8)	3.9	4.7		350–1150	8 MB			US $154
	10305		3.8	4.5						US $143
	10305T		3.0	4.0		350–1100		35 W
	10105		3.7	4.4			6 MB	65 W		US $122
	10105F				US $97
	10105T		3.0	3.9	UHD 630	350–1100		35 W		US $122

Cascade Lake-X (10xxx)

Common features:

• Socket: LGA 2066.
• All the CPUs support quad-channel DDR4-2933 RAM.
• All CPU models provide 48 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Smart Cache	TDP	Release date	MSRP
			Base	Turbo 2.0	Turbo 3.0
Core i9	10980XE	18 (36)	3.0	4.6	4.8	24.75 MB	165 W		US $979
	10940X	14 (28)	3.3			19.25 MB			US $784
	10920X	12 (24)	3.5						US $689
	10900X	10 (20)	3.7	4.5	4.7				US $590

Core i (11th gen)

Rocket Lake-S

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.^[14]
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Integrated GPU		Smart Cache	TDP	Release date	MSRP
			Base	Turbo		Model	Clock (MHz)
Core i9	11900K	8 (16)	3.5	5.2	5.3	UHD 750	350–1300	16 MB	125 W		US $539
	11900KF					US $513
	11900		2.5	5.1	5.2	UHD 750	350–1300		65 W		US $439
	11900F					US $422
	11900T		1.5	4.9	UHD 750	350–1300	35 W		US $439
Core i7	11700K		3.6	5.0	125 W		US $399
	11700KF					US $374
	11700		2.5	4.9	UHD 750	350–1300	65 W		US $323
	11700F				US $298
	11700T		1.4	4.6	UHD 750	350–1300	35 W		US $323
Core i5	11600K	6 (12)	3.9	4.9			12 MB	125 W	US $262
	11600KF				US $237
	11600		2.8	4.8	UHD 750	350–1300		65 W	US $213
	11600T		1.7	4.1				35 W
	11500		2.7	4.6				65 W	US $192
	11500T		1.5	3.9		350–1200		35 W
	11400		2.6	4.4	UHD 730	350–1300		65 W	US $182
	11400F				US $157
	11400T		1.3	3.7	UHD 730	350–1200		35 W	US $182

Tiger Lake-B

Common features:

• Socket: BGA 1787 (soldered).
• All the CPUs support dual-channel DDR4-3200 RAM.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• These CPUs were sold to OEMs only.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	11900KB	8 (16)	3.3	4.9	UHD Graphics (32 EU)	350–1450	24 MB	55–65 W
Core i7	11700B		3.2	4.8
Core i5	11500B	6 (12)	3.3	4.6			12 MB	65 W
Core i3	11100B	4 (8)	3.6	4.4	UHD Graphics (16 EU)	350–1400

Core i (12th gen)

Alder Lake-S

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)				E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date	MSRP
		Cores (Threads)	Clock rate (GHz)			Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo			Base	Turbo
Core i9	12900KS	8 (16)	3.4	5.3	5.5	8 (8)	2.5	4.0	UHD 770	300–1550	30 MB	150 W	241 W		US $739
	12900K		3.2	5.2	2.4		3.9	125 W						US $589
	12900KF				US $564
	12900		2.4	5.1	1.8	3.8	UHD 770	300–1550	65 W	202 W			US $489
	12900F						US $464
	12900T		1.4	4.9	1.0	3.6	UHD 770	300–1550	35 W	106 W			US $489
Core i7	12700K		3.6	5.0	4 (4)	2.7		3.8	300–1500	25 MB	125 W	190 W		US $409
	12700KF						US $384
	12700		2.1	4.9		1.6	3.6	UHD 770	300–1500		65 W	180 W		US $339
	12700F							US $314
	12700T		1.4	4.7		1.0	3.4	UHD 770	300–1500		35 W	106 W		US $339
Core i5	12600K	6 (12)	3.7	4.9		2.8	3.6		300–1450	20 MB	125 W	150 W		US $289
	12600KF							US $264
	12600		3.3	4.8	UHD 770	300–1450	18 MB	65 W	117 W		US $223
	12600T		2.1	4.6	35 W			74 W
	12500		3.0		65 W			117 W	US $202
	12500T		2.0	4.4	35 W			74 W
	12490F^[15]		3.0	4.6	20 MB		65 W	117 W		CN ¥1599
	12400		2.5	4.4	UHD 730	300–1450			18 MB		US $202
	12400F				US $192
	12400T		1.8	4.2	UHD 730	350–1450	35 W	74 W			US $202
Core i3	12300	4 (8)	3.5	4.4			12 MB	60 W	89 W		US $143
	12300T		2.3	4.2				35 W	69 W
	12100		3.3	4.3		300–1400		60 W	89 W		US $122
	12100F				58 W			US $97
	12100T		2.2	4.1	UHD 730	300–1400		35 W	69 W		US $122

Core i (13th gen)

Raptor Lake-S

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
  • E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)				E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date	MSRP
		Cores (Threads)	Clock rate (GHz)			Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo			Base	Turbo
Core i9	13900KS	8 (16)	3.2	5.8	6.0	16 (16)	2.4	4.3	UHD 770	300–1650	36 MB	150 W	253 W		US $689
	13900K		3.0	5.7	5.8		2.2					125 W			US $589
	13900KF								US $564
	13900		2.0	5.5	5.6		1.5	4.2	UHD 770	300–1650		65 W	219 W		US $549
	13900F								US $524
	13900T		1.1	5.3	0.8		3.9	UHD 770	300–1650	35 W		106 W	US $549
Core i7	13790F		2.1	5.2		8 (8)	1.5	4.1	33 MB		65 W	219 W		CN ¥2999
	13700K		3.4	5.4			2.5	4.2	UHD 770	300–1600	30 MB	125 W	253 W		US $409
	13700KF								US $384
	13700		2.1	5.2			1.5	4.1	UHD 770	300–1600		65 W	219 W
	13700F								US $359
	13700T		1.4	4.9			1.0	3.6	UHD 770	300–1600		35 W	106 W		US $384
Core i5	13600K	6 (12)	3.5	5.1			2.6	3.9		300–1500	24 MB	125 W	181 W		US $319
	13600KF								US $294
	13600		2.7	5.0			2.0	3.7	UHD 770	300–1550		65 W	154 W		US $255
	13600T		1.8	4.8			1.3	3.4				35 W	92 W
	13500		2.5				1.8	3.5				65 W	154 W		US $232
	13500T		1.6	4.6			1.2	3.2				35 W	92 W
	13490F		2.5	4.8		4 (4)	1.8	3.5	65 W			148 W		CN ¥1599
	13400			4.6				3.3	UHD 730	300–1550	20 MB	65 W	154 W		US $221
	13400F								148 W				US $196
	13400T		1.3	4.4			1.0	3.0	UHD 730	300–1550		35 W	82 W		US $221
Core i3	13100	4 (8)	3.4	4.5		300–1500				12 MB	60 W	89 W	US $134
	13100F								US $109
	13100T		2.5	4.2					UHD 730	300–1500	35 W	69 W	US $134

Core i (14th gen)

Raptor Lake-S Refresh

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier and can be overclocked.
• i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)				E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date	MSRP
		Cores (Threads)	Clock rate (GHz)			Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo			Base	Turbo
Core i9	14900KS	8 (16)	3.2	5.9	6.2	16 (16)	2.4	4.5	UHD 770	300–1650	36 MB	150 W	253 W		US $689
	14900K			5.8	6.0			4.4				125 W			US $589
	14900KF								US $564
	14900		2.0	5.6	5.8		1.5	4.3	UHD 770	300–1650		65 W	219 W		US $549
	14900F								US $524
	14900T		1.1	5.5	0.9		3.7	UHD 770	300–1650	35 W		106 W	US $549
Core i7	14790F		2.1	5.4		8 (8)	1.5	4.2	65 W			219 W	China only
	14700K		3.4	5.6		12 (12)	2.5	4.3	UHD 770	300–1600	33 MB	125 W	253 W		US $409
	14700KF								US $384
	14700		2.1	5.4			1.5	4.2		UHD 770		300–1600	65 W	219 W
	14700F								US $359
	14700T		1.3	5.2			0.9	3.7	UHD 770	300–1600		35 W	106 W	US $384
Core i5	14600K	6 (12)	3.5	5.3		8 (8)	2.6	4.0		300–1550	24 MB	125 W	181 W		US $319
	14600KF								US $294
	14600		2.7	5.2			2.0	3.9	UHD 770	300–1550		65 W	154 W		US $255
	14600T		1.8	5.1			1.3	3.6				35 W	92 W
	14500		2.6	5.0			1.9	3.7				65 W	154 W		US $232
	14500T		1.7	4.8			1.2	3.4				35 W	92 W
	14490F		2.8	4.9		4 (4)	2.1	3.7	65 W	148 W		China only
	14400		2.5	4.7			1.8	3.5	UHD 730		300–1550	20 MB	US $221
	14400F								US $196
	14400T		1.5	4.5			1.1	3.2	UHD 730	300–1550	35 W		82 W		US $221
Core i3	14100	4 (8)	3.5	4.7		300–1500				12 MB	60 W	110 W	US $134
	14100F								US $109
	14100T		2.7	4.4					UHD 730	300–500	35 W	69 W	US $134

Mobile processors

Core

Yonah

See main article: Yonah (microprocessor).

Core 2

See main article: Intel Core 2.

"Merom-L" (65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Die size: 81 mm²
• Steppings: A1

"Merom", "Merom-2M" (standard-voltage, 65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
• Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
• Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
• Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
• Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
• Die size: 143 mm² (Merom), 111 mm² (Merom-2M)
• Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
• All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
• Die size: 143 mm²
• Steppings: B2, E1, G0, G2

"Merom-2M" (ultra-low-voltage, 65 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
• Die size: 111 mm²
• Steppings: L2, M0

"Merom XE" (65 nm)

These models feature an unlocked clock multiplier

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
• Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
• Die size: 143 mm²
• Steppings: E1, G0

"Penryn-L" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
• Die size: 82 mm²
• 228 million transistors
• Package size: 22 mm × 22 mm
• Steppings: M0, R0

"Penryn" (Apple iMac specific, 45 nm)

• Die size: 107 mm²
• The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
• Steppings: C0, E0

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)^[16]
• T6570,^[17] T6670, all T8xxx and T9xxx models support Intel VT-x
• All T9xxx models support Trusted Execution Technology (TXT)
• T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

• Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
• Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450),^{[18] [19] [20]} Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Select Apple subsets of P7000 series processors support Intel VT-x.^[21]
• Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
• Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
• Package size: 35 mm × 35 mm
• Transistors: 410 million ^[22]
• Steppings: (Core microarchitecture 45nm steppings)
  • C0, E0 (Penryn)
  • M0, R0 (Penryn-3M)
  • stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
  • stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: C0, E0

"Penryn" (low-voltage, 45 nm, Small Form Factor)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: C0, E0

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
• Die size: 107 mm²
• Package size: 22 mm × 22 mm
• Steppings: M0, R0

"Penryn XE" (45 nm)

• These models feature an unlocked clock multiplier
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
• Die size: 107 mm²
• Steppings: C0, E0

"Penryn QC" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
• Die size: 2 × 107 mm²
• Steppings: E0

"Penryn QC XE" (45 nm)

• This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
• Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
• Package size: 35 mm × 35 mm
• Die size: 2 × 107 mm²
• Steppings: E0

Core i (1st gen)

Clarksfield

Common features:

• Socket: G1.
• All the CPUs support dual-channel DDR3-1333 RAM.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 45 nm.
• XM-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Smart Cache	TDP	Release date
			Base	Turbo
Core i7	940XM	4 (8)	2.13	3.33	8 MB	55 W
	920XM		2.00	3.20
	840QM		1.86			45 W
	820QM		1.73	3.06
	740QM			2.93	6 MB
	720QM		1.60	2.80

Arrandale

Common features:

• Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
• All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	680UM	2 (4)	1.46	2.53	HD Graphics	166–500	4 MB	18 W
	660LM		2.26	3.06		266–566		25 W
	660UM		1.33	2.40		166–500		18 W
	640M		2.80	3.46		500–766		35 W
	640LM		2.13	2.93		266–566		25 W
	640UM		1.20	2.27		166–500		18 W
	620M		2.66	3.33		500–766		35 W
	620LM		2.00	2.80		266–566		25 W
	620UM		1.06	2.13		166–500		18 W
Core i5	580M		2.66	3.33		500–766	3 MB	35 W
	560M			3.20
	560UM		1.33	2.13		166–500		18 W
	540M		2.53	3.07		500–766		35 W
	540UM		1.20	2.00		166–500		18 W
	520M		2.40	2.93		500–766		35 W
	520UM		1.07	1.87		166–500		18 W
	480M		2.66	2.93		500–766		35 W
	470UM		1.33	1.86		166–500		18 W
	460M		2.53	2.80		500–766		35 W
	450M		2.40	2.66
	430M		2.26	2.53
	430UM		1.20	1.73		166–500		18 W
Core i3	390M		2.66	500–667		35 W
	380M		2.53
	380UM		1.33	166–500		18 W
	370M		2.40	500–667		35 W
	350M		2.26
	330M		2.13
	330UM		1.20	166–500		18 W

Core i (2nd gen)

Sandy Bridge-M

Common features:

• Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
• All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.
• XM-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	2960XM	4 (8)	2.7	3.7	HD 3000	650–1300	8 MB	55 W
	2920XM		2.5	3.5
	2860QM			3.6				45 W
	2820QM		2.3	3.4
	2760QM		2.4	3.5			6 MB
	2720QM		2.2	3.3
	2675QM			3.1		650–1200
	2670QM					650–1100
	2635QM		2.0	2.9		650–1200
	2630QM					650–1100
	2677M	2 (4)	1.8	2.9		350–1200	4 MB	17 W
	2657M		1.6	2.7		350–1000
	2640M		2.8	3.5		650–1300		35 W
	2649M		2.3	3.2		500–1100		25 W
	2637M		1.7	2.8		350–1200		17 W
	2620M		2.7	3.4		650–1300		35 W
	2629M		2.1	3.0		500–1100		25 W
	2617M		1.5	2.6		350–950		17 W
Core i5	2557M		1.7	2.7		350–1200	3 MB
	2540M		2.6	3.3		650–1300		35 W
	2537M		1.4	2.3		350–900		17 W
	2520M		2.5	3.2		650–1300		35 W
	2467M		1.6	2.3		350–1150		17 W
	2450M		2.5	3.1		650–1300		35 W
	2435M		2.4	3.0
	2430M					650–1200
	2415M		2.3	2.9		650–1300			Q1 2011
	2410M					650–1200
Core i3	2370M		2.4	650–1150
	2377M		1.5			350–1000		17 W
	2375M								Q1 2013
	2367M		1.4
	2365M
	2350M		2.3			650–1150		35 W
	2357M		1.3			350–950		17 W
	2348M		2.3			650–1150		35 W
	2332M^[23]		2.2			650–1100
	2330M
	2328M
	2312M		2.1						Q2 2011
	2310M
	2308M^[24]								Q3 2012

Core i (3rd gen)

Ivy Bridge

Common features:

• Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
• All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• XM-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	3940XM	4 (8)	3.0	3.9	HD 4000	650–1350	8 MB	55 W
	3920XM		2.9	3.8		650–1300
	3840QM		2.8					45 W
	3820QM		2.7	3.7		650–1250
	3740QM					650–1300	6 MB
	3720QM		2.6	3.6		650–1250
	3635QM		2.4	3.4		650–1200
	3630QM					650–1150
	3632QM		2.2	3.2				35 W
	3615QM		2.3	3.3		650–1200		45 W
	3610QM					650–1100
	3612QM		2.1	3.1				35 W
	3687U	2 (4)	2.1	3.3		350–1200	4 MB	17 W
	3689Y		1.5	2.6		350–850		13 W
	3667U		2.0	3.2		350–1150		17 W
	3540M		3.0	3.7		650–1300		35 W
	3537U		2.0	3.1		350–1200		17 W
	3520M		2.9	3.6		650–1250		35 W
	3517U		1.9	3.0		350–1150		17 W
Core i5	3437U			2.9		650–1200	3 MB
	3439Y		1.5	2.3		350–850		13 W
	3427U		1.8	2.8		350–1150		17 W
	3380M		2.9	3.6		650–1250		35 W
	3360M		2.8	3.5		650–1200
	3340M		2.7	3.4		650–1250
	3337U		1.8	2.7		350–1100		17 W
	3339Y		1.5	2.0		350–850		13 W
	3320M		2.6	3.3		650–1200		35 W
	3317U		1.7	2.6		350–1050		17 W
	3230M		2.6	3.2		650–1100		35 W
	3210M		2.5	3.1
Core i3	3227U		1.9	350–1100		17 W
	3229Y		1.4			350–850			13 W
	3217U		1.8			350–1050		17 W
	3130M		2.6			650–1100		35 W
	3120M		2.5
	3110M		2.4			650–1000

Core i (4th gen)

Haswell-MB

Common features:

• Socket: G3.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.
• MX-suffix models have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4940MX	4 (8)	3.1	4.0	HD 4600	400–1350	8 MB	57 W
	4930MX		3.0	3.9
	4910MQ		2.9			400–1300		47 W
	4900MQ		2.8	3.8
	4810MQ						6 MB
	4800MQ		2.7	3.7
	4710MQ		2.5	3.5		400–1150
	4712MQ		2.3	3.3				37 W
	4700MQ		2.4	3.4				47 W
	4702MQ		2.2	3.2				37 W
	4610M	2 (4)	3.0	3.7		400–1300	4 MB
	4600M		2.9	3.6
Core i5	4340M					400–1250	3 MB
	4330M		2.8	3.5
	4310M		2.7	3.4
	4300M		2.6	3.3
	4210M			3.2		400–1150
	4200M		2.5	3.1
Core i3	4110M		2.6	400–1100
	4100M		2.5
	4010M^[25]			Q3 2014
	4000M		2.4

Haswell-ULT

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4650U	2 (4)	1.7	3.3	HD 5000	200–1100	4 MB	15 W
	4600U		2.1		HD 4400
	4578U		3.0	3.5	Iris 5100	200–1200		28 W
	4558U		2.8	3.3
	4550U		1.5	3.0	HD 5000	200–1100		15 W
	4510U		2.0	3.1	HD 4400
	4500U		1.8	3.0
Core i5	4360U		1.5		HD 5000		3 MB
	4350U		1.4	2.9
	4310U		2.0	3.0	HD 4400
	4308U		2.8	3.3	Iris 5100	200–1200		28 W
	4300U		1.9	2.9	HD 4400	200–1100		15 W
	4288U		2.6	3.1	Iris 5100	200–1200		28 W
	4278U					200–1100
	4260U		1.4	2.7	HD 5000	200–1000		15 W
	4258U		2.4	2.9	Iris 5100	200–1100		28 W
	4250U		1.3	2.6	HD 5000	200–1000		15 W
	4210U		1.7	2.7	HD 4400
	4200U		1.6	2.6
Core i3	4158U		2.0	Iris 5100	200–1100	28 W
	4120U				HD 4400	200–1000		15 W
	4100U		1.8
	4030U		1.9
	4025U					200–950
	4010U		1.7			200–1000
	4005U					200–950

Haswell-ULX

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4610Y	2 (4)	1.7	2.9	HD 4200	200–850	4 MB	11.5 W
Core i5	4302Y		1.6	2.3			3 MB
	4300Y
	4220Y			2.0
	4210Y		1.5	1.9
	4202Y		1.6	2.0
	4200Y		1.4	1.9
Core i3	4030Y		1.6
	4020Y		1.5
	4012Y
	4010Y		1.3

Haswell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 22 nm.
• i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4980HQ	4 (8)	2.8	4.0	Iris Pro 5200	200–1300	6 MB	47 W
	4960HQ		2.6	3.8
	4950HQ		2.4	3.6
	4870HQ		2.5	3.7		200–1200
	4860HQ		2.4	3.6
	4850HQ		2.3	3.5
	4770HQ		2.2	3.4
	4760HQ		2.1	3.3
	4750HQ		2.0	3.2
	4720HQ		2.6	3.6	HD 4600	400–1200
	4722HQ		2.4	3.4		400–1150		37 W
	4710HQ		2.5	3.5		400–1200		47 W
	4712HQ		2.3	3.3		400–1150		37 W
	4700HQ		2.4	3.4		400–1200		47 W
	4702HQ		2.2	3.2		400–1150		37 W
Core i5	4210H	2 (4)	2.9	3.5			3 MB	47 W
	4200H		2.8	3.4

Core i (5th gen)

Broadwell-U

Common features:

• Socket: BGA 1168.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5650U	2 (4)	2.2	3.2	HD 6000	300–1000	4 MB	15 W
	5600U		2.6		HD 5500	300–950
	5557U		3.1	3.4	Iris 6100	300–1100		28 W
	5550U		2.0	3.0	HD 6000	300–1000		15 W
	5500U		2.4		HD 5500	300–950
Core i5	5350U		1.8	2.9	HD 6000	300–1000	3 MB
	5300U		2.3		HD 5500	300–900
	5287U		2.9	3.3	Iris 6100	300–1100		28 W
	5257U		2.7	3.1		300–1050
	5250U		1.6	2.7	HD 6000	300–1000		15 W
	5200U		2.2		HD 5500	300–900
Core i3	5157U		2.5	Iris 6100	300–1000	28 W
	5020U		2.2		HD 5500	300–900		15 W
	5015U		2.1			300–850
	5010U					300–900
	5005U		2.0			300–850

Broadwell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5950HQ	4 (8)	2.9	3.7	Iris Pro 6200	300–1150	6 MB	47 W
	5850HQ		2.7	3.6		300–1100
	5750HQ		2.5	3.4		300–1050
	5700HQ		2.7	3.5	HD 5600
Core i5	5350H	2 (4)	3.1		Iris Pro 6200		4 MB

Core M (5th gen)

Broadwell-Y

Common features:

• Socket: BGA 1234.
• All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 12 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core M	5Y71	2 (4)	1.2	2.9	HD 5300	300–900	4 MB	4.5 W
	5Y70		1.1	2.6		100–850
	5Y51					300–900
	5Y31		0.9	2.4		300–850
	5Y10c		0.8	2.0		300–800
	5Y10a					100–800
	5Y10

Core i (6th gen)

Skylake-U

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6660U	2 (4)	2.4	3.4	Iris 540	300–1050	4 MB	15 W
	6650U		2.2
	6600U		2.6		HD 520
	6567U		3.3	3.6	Iris 550	300–1100		28 W
	6560U		2.2	3.2	Iris 540	300–1050		15 W
	6500U		2.5	3.1	HD 520
	6498DU				HD 510
Core i5	6360U		2.0		Iris 540	300–1000	3 MB
	6300U		2.4	3.0	HD 520
	6287U		3.1	3.5	Iris 550	300–1100	4 MB	28 W
	6267U		2.9	3.3		300–1050
	6260U		1.8	2.9	Iris 540	300–950		15 W
	6200U		2.3	2.8	HD 520	300–1000	3 MB
	6198DU				HD 510
Core i3	6167U		2.7	Iris 550	28 W
	6157U		2.4
	6100U		2.3	HD 520	15 W
	6006U		2.0			300–900

Skylake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6970HQ	4 (8)	2.8	3.7	Iris Pro 580	350–1050	8 MB	45 W
	6920HQ		2.9	3.8	HD 530
	6870HQ		2.7	3.6	Iris Pro 580	350–1000
	6820HQ				HD 530	350–1050
	6820HK
	6770HQ		2.6	3.5	Iris Pro 580	350–950	6 MB
	6700HQ				HD 530	350–1050
Core i5	6440HQ	4 (4)				350–950
	6350HQ		2.3	3.2	Iris Pro 580	350–900
	6300HQ				HD 530	350–950
Core i3	6100H	2 (4)	2.7			350–900	3 MB	35 W

Core M (6th gen)

Skylake-Y

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m7	6Y75	2 (4)	1.2	3.1	HD 515	300–1000	4 MB	4.5 W
Core m5	6Y57		1.1	2.8		300–900
	6Y54			2.7
Core m3	6Y30		0.9	2.2		300–850

Core i (7th gen)

Kaby Lake-U

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7660U	2 (4)	2.5	4.0	Iris Plus 640	300–1100	4 MB	15 W
	7600U		2.8	3.9	HD 620	300–1150
	7567U		3.5	4.0	Iris Plus 650			28 W
	7560U		2.4	3.8	Iris Plus 640	300–1050		15 W
	7500U		2.7	3.5	HD 620
Core i5	7360U		2.3	3.6	Iris Plus 640	300–1000
	7300U		2.6	3.5	HD 620	300–1100	3 MB
	7287U		3.3	3.7	Iris Plus 650		4 MB	28 W
	7267U		3.1	3.5		300–1050
	7260U		2.2	3.4	Iris Plus 640	300–950		15 W
	7200U		2.5	3.1	HD 620	300–1000	3 MB
Core i3	7167U		2.8	Iris Plus 650	28 W
	7130U		2.7		HD 620			15 W
	7100U		2.4
	7020U		2.3						Q2 2018

Kaby Lake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7920HQ	4 (8)	3.1	4.1	HD 630	350–1100	8 MB	45 W
	7820HK		2.9	3.9
	7820HQ
	7700HQ		2.8	3.8			6 MB
Core i5	7440HQ	4 (4)				300–1000
	7300HQ		2.5	3.5
Core i3	7100H	2 (4)	3.0			300–950	3 MB	35 W

Kaby Lake-Y

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7Y75	2 (4)	1.3	3.6	HD 615	300–1050	4 MB	4.5 W
Core i5	7Y57		1.2	3.3		300–950
	7Y54			3.2

Core M (7th gen)

Kaby Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core m3	7Y32	2 (4)	1.1	3.0	HD 615	300–900	4 MB	4.5 W
	7Y30		1.0	2.6

Core i (8th gen)

Coffee Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8569U	4 (8)	2.8	4.7	Iris Plus 655	300–1200	8 MB	28 W
	8559U		2.7	4.5
	8557U		1.7		Iris Plus 645	300–1150		15 W
Core i5	8279U		2.4	4.1	Iris Plus 655		6 MB	28 W
	8269U		2.6	4.2		300–1100
	8260U		1.6	3.9	UHD 620			15 W	Q4 2019
	8259U		2.3	3.8	Iris Plus 655	300–1050		28 W
	8257U		1.4	3.9	Iris Plus 645			15 W
Core i3	8140U	2 (4)	2.1		UHD 620	300–1000	4 MB	15 W	Q4 2019
	8109U		3.0	3.6	Iris Plus 655	300–1050		28 W

Coffee Lake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	8950HK	6 (12)	2.9	4.8	UHD 630	350–1200	12 MB	45 W
Core i7	8850H		2.6	4.3		350–1150	9 MB
	8750H		2.2	4.1		350–1100
Core i5	8400H	4 (8)	2.5	4.2			8 MB
	8300H		2.3	4.0		350–1000
Core i3	8100H	4 (4)	3.0				6 MB

Coffee Lake-B

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8700B	6 (12)	3.2	4.6	UHD 630	350–1200	12 MB	65 W
Core i5	8500B	6 (6)	3.0	4.1		350–1100	9 MB
	8400B		2.8	4.0		350–1050
Core i3	8100B	4 (4)	3.6				6 MB		Q3 2018

Kaby Lake Refresh

Common features:

• Socket: BGA 1356.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8650U	4 (8)	1.9	4.2	UHD 620	300–1150	8 MB	15 W
	8550U		1.8	4.0
Core i5	8350U		1.7	3.6		300–1100	6 MB
	8250U		1.6	3.4
Core i3	8130U	2 (4)	2.2			300–1000	4 MB

Kaby Lake-G

Common features:

• Socket: BGA 2270.
• All the CPUs support dual-channel DDR4-2400 RAM.
• All CPU models provide 8 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Embedded dGPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)	Model	Clock (MHz)
Core i7	8809G	4 (8)	3.1	4.2	HD 630	350–1100	RX Vega M GH	1063–1190	8 MB	100 W
	8709G			4.1
	8706G						RX Vega M GL	931–1011		65 W
	8705G
Core i5	8305G		2.8	3.2		350–1000			6 MB

Amber Lake-Y

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8500Y	2 (4)	1.5	4.2	UHD 615	300–1050	4 MB	5 W
Core i5	8310Y		1.6	3.9	UHD 617			7 W	Q1 2019
	8210Y			3.6
	8200Y		1.3	3.9	UHD 615	300–950		5 W

Whiskey Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8665U	4 (8)	1.9	4.8	UHD 620	300–1150	8 MB	15 W
	8565U		1.8	4.6
Core i5	8365U		1.6	4.1		300–1100	6 MB
	8265U			3.9
Core i3	8145U	2 (4)	2.1			300–1000	4 MB

Cannon Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 10 nm.

Core M (8th gen)

Amber Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

• Socket: BGA 1515.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Core i (9th gen)

Coffee Lake-H (refresh)

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	9980HK	8 (16)	2.4	5.0	UHD 630	350–1250	16 MB	45 W
	9880H		2.3	4.8		350–1200
Core i7	9850H	6 (12)	2.6	4.6		350–1150	12 MB
	9750H			4.5
	9750HF				colspan="2"
Core i5	9400H	4 (8)	2.5	4.3	UHD 630	350–1100	8 MB
	9300H		2.4	4.1		350–1050
	9300HF

Core i (10th gen)

Comet Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	10810U	6 (12)	1.1	4.7	UHD 620	300–1150	12 MB	15 W
	10710U
	10610U	4 (8)	1.8	4.9			8 MB
	10510U
Core i5	10310U		1.7	4.4			6 MB
	10210U		1.6	4.2		300–1100
Core i3	10110U	2 (4)	2.1	4.1		300–1000	4 MB

Comet Lake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)			Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo		Model	Clock (MHz)
Core i9	10980HK	8 (16)	2.4	5.1	5.3	UHD 630	350–1250	16 MB	45 W
	10885H
Core i7	10875H		2.3	4.9	5.1		350–1200
	10870H		2.2	4.8	5.0
	10850H	6 (12)	2.7	4.9	5.1		350–1150	12 MB
	10750H		2.6	4.8	5.0
Core i5	10500H		2.5	4.5	350–1050
	10400H	4 (8)	2.6	4.6			350–1100	8 MB
	10300H		2.5	4.5			350–1050
	10200H		2.4	4.1

Ice Lake-U

Common features:

• Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
• PCIe 3.0 support.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1068NG7	4 (8)	2.3	4.1	Iris Plus (G7)	300–1100	8 MB	28 W
	1068G7^[26]
	1065G7		1.3	3.9				15 W
Core i5	1038NG7		2.0	3.8		300–1050	6 MB	28 W
	1035G7		1.2	3.7				15 W
	1035G4		1.1		Iris Plus (G4)
	1035G1		1.0	2.6	UHD Graphics (G1)
Core i3	1005G1	2 (4)	1.2	3.4		300–900	4 MB

Ice Lake-Y

Common features:

• Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
• All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
• PCIe 3.0 support.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 512 KB per core.
• Fabrication process: 10 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1060G7	4 (8)	1.0	3.8	Iris Plus (G7)	300–1100	8 MB	9 W	Q3 2019
Core i5	1030NG7		1.1	3.5		300–1050	6 MB	10 W	Q2 2020
	1030G7		0.8					9 W	Q3 2019
	1030G4		0.7		Iris Plus (G4)
Core i3	1000NG4	2 (4)	1.1	3.2		300–900	4 MB		Q2 2020
	1000G4								Q3 2019
	1000G1				UHD Graphics (G1)

Amber Lake-Y (10xxx)

Common features:

• Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
• All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
• All CPU models provide 10 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	10510Y	4 (8)	1.2	4.5	UHD 620	300–1150	8 MB	7 W
Core i5	10310Y		1.1	4.1		300–1050	6 MB
	10210Y		1.0	4.0
Core i3	10110Y	2 (4)				300–1000	4 MB
	10100Y		1.3	3.9	UHD 615			5 W

Core i (11th gen)

Tiger Lake-UP3

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1195G7	4 (8)	1.3–2.9	5.0	Iris Xe (96 EU)	?–1400	12 MB	12–28 W
	1185G7		1.2–3.0	4.8		?–1350
	1165G7		1.2–2.8	4.7		?–1300
Core i5	1155G7		1.0–2.5	4.5	Iris Xe (80 EU)	?–1350	8 MB
	1145G7		1.1–2.6	4.4		?–1300
	1135G7		0.9–2.4	4.2
Core i3	1125G4		0.9–2.0	3.7	UHD Graphics (48 EU)	?–1250			Q1 2021
	1115G4	2 (4)	1.7–3.0	4.1			6 MB

Tiger Lake-UP4

Common features:

• Socket: BGA 1598.
• All the CPUs support dual-channel LPDDR4X-4266 RAM.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1180G7	4 (8)	0.9–2.2	4.6	Iris Xe (96 EU)	?–1100	12 MB	7–15 W
	1160G7		0.9–2.1	4.4
Core i5	1140G7		0.8–1.8	4.2	Iris Xe (80 EU)		8 MB
	1130G7			4.0
Core i3	1120G4		0.8–1.5	3.5	UHD Graphics (48 EU)				Q1 2021
	1110G4	2 (4)	1.8	3.9			6 MB

Tiger Lake-H

Common features:

• Socket: BGA 1598.
• All the CPUs support dual-channel DDR4-3200 RAM.
• All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	11980HK	8 (16)	2.6–3.3	5.0	UHD Graphics (32 EU)	350–1450	24 MB	45–65 W
	11950H		2.1–2.6					35–45 W
	11900H		2.1–2.5	4.9
Core i7	11850H			4.8
	11800H		1.9–2.3	4.6
	11600H	6 (12)	2.5–2.9				18 MB
Core i5	11500H		2.4–2.9				12 MB
	11400H		2.2–2.7	4.5	UHD Graphics (16 EU)
	11260H		2.1–2.6	4.4		350–1400

Tiger Lake-H35

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
• PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	11390H	4 (8)	2.9–3.4	5.0	Iris Xe (96 EU)	?–1400	12 MB	28–35 W
	11375H		3.0–3.3			?–1350
	11370H			4.8
Core i5	11320H		2.5–3.2	4.5			8 MB
	11300H		2.6–3.1	4.4	Iris Xe (80 EU)	?–1300

Core i (12th gen)

Alder Lake-U

Common features:

• Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
• All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
• ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1265U	2 (4)	1.8	4.8	8 (8)	1.3	3.6	Iris Xe (96 EU)	?–1250	12 MB	15 W	55 W
	1260U		1.1	4.7		0.8	3.5		?–950		9 W	29 W
	1255U		1.7			1.2			?–1250		15 W	55 W
	1250U		1.1			0.8			?–950		9 W	29 W
Core i5	1245U		1.6	4.4		1.2	3.3	Iris Xe (80 EU)	?–1200		15 W	55 W
	1240U		1.1			0.8			?–900		9 W	29 W
	1235U		1.3			0.9			?–1200		15 W	55 W
	1230U		1.0			0.7			?–850		9 W	29 W
Core i3	1215U		1.2		4 (4)	0.9		UHD Graphics (64 EU)	?–1100	10 MB	15 W	55 W
	1210U		1.0			0.7			?–850		9 W	29 W

Alder Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The following models are available with IPU (infrastructure processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1280P	6 (12)	1.8	4.8	8 (8)	1.3	3.6	Iris Xe (96 EU)	?–1450	24 MB	28 W	64 W
	1270P	4 (8)	2.2			1.6	3.5		?–1400	18 MB
	1260P		2.1	4.7		1.5	3.4
Core i5	1250P		1.7	4.4		1.2	3.3	Iris Xe (80 EU)		12 MB
	1240P								?–1300
Core i3	1220P	2 (4)	1.5			1.1		UHD Graphics (64 EU)	?–1100

Alder Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	12900HK	6 (12)	2.5	5.0	8 (8)	1.8	3.8	Iris Xe (96 EU)	?–1450	24 MB	45 W	115 W
	12900H
Core i7	12800H		2.4	4.8			3.7		?–1400
	12700H		2.3	4.7		1.7	3.5
	12650H				4 (4)			UHD Graphics (64 EU)
Core i5	12600H	4 (8)	2.7	4.5	8 (8)	2.0	3.3	Iris Xe (80 EU)		18 MB		95 W
	12500H		2.5			1.8			?–1300
	12450H		2.0	4.4	4 (4)	1.5		UHD Graphics (48 EU)	?–1200	12 MB

Alder Lake-HX

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The i9 models have unlocked multipliers, allowing them to be overclocked.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	12950HX	8 (16)	2.3	5.0	8 (8)	1.7	3.6	UHD Graphics (32 EU)	?–1550	30 MB	55 W	157 W
	12900HX
Core i7	12850HX		2.1	4.8		1.5	3.4		?–1450	25 MB
	12800HX		2.0
	12650HX	6 (12)		4.7			3.3			24 MB
Core i5	12600HX	4 (8)	2.5	4.6		1.8			?–1350	18 MB
	12450HX		2.4	4.4	4 (4)		3.1	UHD Graphics (16 EU)	?–1300	12 MB

Alder Lake-N

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

• Socket: BGA 1264.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
• All CPU models provide 9 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache: 2 MB per cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP		Release date
			Base	Turbo	Model	Clock (MHz)		Base	Max. Turbo
Core i3	N305	8 (8)	1.8	3.8	UHD Graphics (32 EU)	?–1250	6 MB	15 W	35 W
	N300		0.8					7 W	25 W

Core i (13th gen)

Raptor Lake-U

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The i3-1315U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1365U	2 (4)	1.8	5.2	8 (8)	1.3	3.9	Iris Xe (96 EU)	?–1300	12 MB	15 W	55 W
	1355U		1.7	5.0		1.2	3.7
Core i5	1345U		1.6	4.7			3.5	Iris Xe (80 EU)	?–1250
	1335U		1.3	4.6		0.9	3.4
	1334U
Core i3	1315U		1.2	4.5	4 (4)		3.3	UHD Graphics (64 EU)		10 MB
	1305U	1 (2)	1.6			1.2

Raptor Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1370P	6 (12)	1.9	5.2	8 (8)	1.4	3.9	Iris Xe (96 EU)	?–1500	24 MB	28 W	64 W
	1360P	4 (8)	2.2	5.0		1.6	3.7			18 MB
Core i5	1350P		1.9	4.7		1.4	3.5	Iris Xe (80 EU)		12 MB
	1340P			4.6			3.4		?–1450

Raptor Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
• The i5-13500H is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13900HK	6 (12)	2.6	5.4	8 (8)	1.9	4.1	Iris Xe (96 EU)	?–1500	24 MB	45 W	115 W
	13900H
Core i7	13800H		2.5	5.2		1.8	4.0
	13700H		2.4	5.0			3.7
	13620H			4.9	4 (4)		3.6	UHD Graphics (64 EU)
Core i5	13600H	4 (8)	2.8	4.8	8 (8)	2.1		Iris Xe (80 EU)		18 MB		95 W
	13500H		2.6	4.7		1.9	3.5		?–1450
	13420H		2.1	4.6	4 (4)	1.5	3.4	UHD Graphics (48 EU)	?–1400	12 MB

Raptor Lake-PX

Common features:

• Socket: BGA 1792.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13905H	6 (12)	2.6	5.4	8 (8)	1.9	4.1	Iris Xe (96 EU)	?–1500	24 MB	45 W	115 W
Core i7	13705H		2.4	5.0		1.8	3.7
Core i5	13505H	4 (8)	2.6	4.7		1.9	3.5	Iris Xe (80 EU)	?–1450	18 MB

Raptor Lake-HX

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• All models support CPU, iGPU, and memory overclocking.^[27]
• i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	13980HX	8 (16)	2.2	5.6	16 (16)	1.6	4.0	UHD Graphics (32 EU)	?–1650	36 MB	55 W	157 W
	13950HX			5.5
	13900HX			5.4			3.9
Core i7	13850HX		2.1	5.1	12 (12)	1.5	3.8		?–1600	30 MB
	13700HX			5.0	8 (8)		3.6		?–1550
	13650HX	6 (12)	2.6	4.9		1.9		UHD Graphics (16 EU)		24 MB
Core i5	13600HX			4.7				UHD Graphics (32 EU)	?–1500
	13500HX		2.5	4.6		1.8	3.5
	13450HX		2.4		4 (4)		3.4	UHD Graphics (16 EU)	?–1450	20 MB

Core i (14th gen)

Raptor Lake-HX Refresh

Common features:

• Socket: BGA 1964.
• All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
• All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• All models support CPU, iGPU, and memory overclocking.
• i7 and up models feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i9	14900HX	8 (16)	2.2	5.8	16 (16)	1.6	4.1	UHD Graphics (32 EU)	?–1650	36 MB	55 W	157 W
Core i7	14700HX		2.1	5.5	12 (12)	1.5	3.9		?–1600	33 MB
	14650HX		2.2	5.2	8 (8)	1.6	3.7	UHD Graphics (16 EU)		30 MB
Core i5	14500HX	6 (12)	2.6	4.9		1.9	3.5	UHD Graphics (32 EU)	?–1550	24 MB
	14450HX		2.4	4.8	4 (4)	1.8		UHD Graphics (16 EU)	?–1500	20 MB

Core / Core Ultra 3/5/7/9 (Series 1)

Raptor Lake-U Refresh

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Xe-LP architecture.
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• The Core 3 100U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core 7	150U	2 (4)	1.8	5.4	8 (8)	1.2	4.0	Intel Graphics (96 EU)	?–1300	12 MB	15 W	55 W
Core 5	120U		1.4	5.0		0.9	3.8	Intel Graphics (80 EU)	?–1250
Core 3	100U		1.2	4.7	4 (4)		3.3	Intel Graphics (64 EU)		10 MB

Meteor Lake-U

Common features:

• Socket: BGA 2049.
• All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 7	165U	2 (4)	1.7	4.9	8 (8)	1.2	3.8	Intel Graphics (4 Xe-cores)	?–2000	12 MB	15 W	57 W
	164U		1.1	4.8		0.7			?–1800		9 W	30 W
	155U		1.7			1.2			?–1950		15 W	57 W
Core Ultra 5	135U		1.6	4.4		1.1	3.6		?–1900
	134U		0.7			0.5			?–1750		9 W	30 W
	125U		1.3	4.3		0.8			?–1850		15 W	57 W
	115U		1.5	4.2	4 (4)	1.0	3.5	Intel Graphics (3 Xe-cores)	?–1800	10 MB

Meteor Lake-H

Common features:

• Socket: BGA 2049.
• All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 9	185H	6 (12)	2.3	5.1	8 (8)	1.8	3.8	Intel Arc (8 Xe-cores)	?–2350	24 MB	45 W	115 W
Core Ultra 7	165H		1.4	5.0		0.9			?–2300		28 W
	155H			4.8					?–2250
Core Ultra 5	135H	4 (8)	1.7	4.6		1.2	3.6		?–2200	18 MB
	125H		1.2	4.5		0.7		Intel Arc (7 Xe-cores)

Embedded processors

Core i (1st gen)

Arrandale

Common features:

• Socket: BGA 1288.
• All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 1.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	660UE	2 (4)	1.33	2.40	HD Graphics	166–500	4 MB	18 W
	620LE		2.00	2.80		266–566		25 W
	620UE		1.06	2.13		166–500		18 W
	610E		2.53	3.20		500–766		35 W
Core i5	520E		2.40	2.93			3 MB
Core i3	330E		2.13			500–666

Core i (2nd gen)

Sandy Bridge-DT

The following models from the Sandy Bridge desktop range are available as embedded processors:

• Core i7-2600
• Core i5-2400
• Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M

Common features:

• Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
• All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	2715QE	4 (8)	2.1	3.0	HD 3000	650–1200	6 MB	45 W
	2710QE
	2655LE	2 (4)	2.2	2.9		650–1000	4 MB	25 W
	2610UE		1.5	2.4		350–850		17 W
Core i5	2515E		2.5	3.1		650–1100	3 MB	35 W
	2510E
Core i3	2340UE		1.3	350–800		17 W
	2330E		2.2			650–1050			35 W
	2310E		2.1

Gladden

Common features:

• Socket: BGA 1284.
• All the CPUs support dual-channel DDR3-1333 RAM.
• All CPU models provide 16 lanes of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Core i (3rd gen)

Ivy Bridge-DT

The following models from the Ivy Bridge desktop range are available as embedded processors:

• Core i7-3770
• Core i5-3550S
• Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M

Common features:

• Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
• All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
• i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 32 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	3615QE	4 (8)	2.3	3.3	HD 4000	650–1000	6 MB	45 W
	3610QE
	3612QE		2.1	3.1				35 W
	3555LE	2 (4)	2.5	3.2		550–1000	4 MB	25 W
	3517UE		1.7	2.8		350–1000		17 W
Core i5	3610ME		2.7	3.3		650–950	3 MB	35 W
Core i3	3217UE		1.6	350–900		17 W
	3120ME		2.4			650–900			35 W

Gladden

Common features:

• Socket: BGA 1284.
• All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
• All CPU models provide 20 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• No integrated graphics.
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Core i (4th gen)

Haswell-DT

Common features:

• Socket: LGA 1150.
• All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4770TE	4 (8)	2.3	3.3	HD 4600	350–1000	8 MB	45 W
Core i5	4570TE	2 (4)	2.7				4 MB	35 W
Core i3	4340TE		2.6
	4330TE		2.4

The following models from the Haswell-DT desktop range are also available as embedded processors:

• Core i7-4790S
• Core i7-4770S
• Core i5-4590S
• Core i5-4590T
• Core i5-4570S
• Core i3-4360
• Core i3-4350T
• Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	4860EQ	4 (8)	1.8	3.2	Iris Pro 5200	750–1000	6 MB	47 W
	4850EQ		1.6	3.2		650–1000
	4701EQ		2.4	3.4	HD 4600	400–1000			Q3 2013
	4700EQ
	4700EC		2.7	8 MB	43 W
	4702EC		2.0	27 W
Core i5	4422E	2 (4)	1.8	2.9	HD 4600	400–900	3 MB	25 W
	4410E		2.9			400–1000		37 W
	4400E		2.7	3.3		400–1000
	4402E		1.6	2.7		400–900		25 W
	4402EC		2.5	4 MB	27 W
Core i3	4110E		2.6	HD 4600	400–900	3 MB	37 W
	4112E		1.8				25 W
	4100E		2.4				37 W
	4102E		1.6				25 W

Core i (5th gen)

Broadwell-H

Common features:

• Socket: BGA 1364.
• All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 2.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	5850EQ	4 (8)	2.7	3.4	Iris Pro 6200	300–1000	6 MB	47 W
	5700EQ		2.6		HD 5600

Core i (6th gen)

Skylake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6700TE	4 (8)	2.4	3.4	HD 530	350–1000	8 MB	35 W
Core i5	6500TE	4 (4)	2.3	3.3			6 MB
Core i3	6100TE	2 (4)	2.7				4 MB		Q4 2015

Skylake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	6820EQ	4 (8)	2.8	3.5	HD 530	350–1000	8 MB	45 W
	6822EQ		2.0	2.8				25 W
Core i5	6440EQ	4 (4)	2.7	3.4			6 MB	45 W
	6442EQ		1.9	2.7				25 W
Core i3	6100E	2 (4)	2.7	350–950		3 MB	35 W
	6102E		1.9	25 W

Core i (7th gen)

Kaby Lake-S

Common features:

• Socket: LGA 1151.
• All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i3	7101E	2 (4)	3.9	HD 610	350–1100	3 MB	54 W
	7101TE		3.4	35 W

Kaby Lake-H

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2400 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	7820EQ	4 (8)	3.0	3.7	HD 630	350–1000	8 MB	45 W
Core i5	7440EQ	4 (4)	2.9	3.6			6 MB
	7442EQ		2.1	2.9				25 W
Core i3	7100E	2 (4)	2.9	350–950		3 MB	35 W
	7102E		2.1	25 W

Core i (8th gen)

Whiskey Lake-U

Common features:

• Socket: BGA 1528.
• All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	8665UE	4 (8)	1.7	4.4	UHD 620	300–1150	8 MB	15 W
Core i5	8365UE		1.6	4.1		300–1050	6 MB
Core i3	8145UE	2 (4)	2.2	3.9		300–1000	4 MB

Core i (9th gen)

Coffee Lake-R

Common features:

• Socket: LGA 1151-2.
• All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	9700E	8 (8)	2.6	4.4	UHD 630	350–1150	12 MB	65 W
	9700TE		1.8	3.8				35 W
Core i5	9500E	6 (6)	3.0	4.2		350–1100	9 MB	65 W
	9500TE		2.2	3.6				35 W
Core i3	9100E	4 (4)	3.1	3.7		350–1050	6 MB	65 W
	9100TE		2.2	3.2				35 W

Coffee Lake-H (refresh)

Common features:

• Socket: BGA 1440.
• All the CPUs support dual-channel DDR4-2666 RAM.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	9850HE	6 (12)	2.7	4.4	UHD 630	350–1150	9 MB	45 W
	9850HL		1.9	4.1				25 W
Core i3	9100HL	4 (4)	1.6	2.9		350–1100	6 MB

Core i (10th gen)

Comet Lake-S

Common features:

• Socket: LGA 1200.
• All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
• All CPU models provide 16 lanes of PCIe 3.0.
• All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
• L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
• L2 cache: 256 KB per core.
• Fabrication process: 14 nm.
• i9-10900E features Thermal Velocity Boost.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i9	10900E	10 (20)	2.8	4.7	UHD 630	350–1200	20 MB	65 W
	10900TE		1.8	4.5				35 W
Core i7	10700E	8 (16)	2.9			350–1150	16 MB	65 W
	10700TE		2.0	4.4				35 W
Core i5	10500E	6 (12)	3.1	4.2			12 MB	65 W
	10500TE		2.3	3.7				35 W
Core i3	10100E	4 (8)	3.2	3.8		350–1100	6 MB	65 W
	10100TE		2.3	3.6				35 W

Core i (11th gen)

Tiger Lake-UP3

Common features:

• Socket: BGA 1449.
• All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
• All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
• -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	1185GRE	4 (8)	1.8	4.4	Iris Xe (96 EU)	?–1350	12 MB	15 W
	1185G7E
Core i5	1145GRE		1.5	4.1	Iris Xe (80 EU)	?–1300	8 MB
	1145G7E
Core i3	1115GRE	2 (4)	2.2	3.9	UHD Graphics (48 EU)	?–1250	6 MB
	1115G4E

Tiger Lake-H

Common features:

• Socket: BGA 1598.
• All the CPUs support dual-channel DDR4-3200 RAM.
• All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 3.0 bus to the chipset (PCH).
• L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
• L2 cache: 1.25 MB per core.
• Fabrication process: 10 nm.
• The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
• Minimum operating temperature: 0°C.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)		Integrated GPU		Smart Cache	TDP	Release date
			Base	Turbo	Model	Clock (MHz)
Core i7	11850HE	8 (16)	2.1–2.6	4.7	UHD Graphics (32 EU)	350–1350	24 MB	35–45 W
Core i5	11500HE	6 (12)		4.5			12 MB
Core i3	11100HE	4 (8)	1.9–2.4	4.4	UHD Graphics (16 EU)	350–1250	8 MB

Core i (12th gen)

Alder Lake-S

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• Turbo Boost version is 2.0.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP	Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)
			Base	Turbo		Base	Turbo
Core i9	12900E	8 (16)	2.3	5.0	8 (8)	1.7	3.8	UHD 770	300–1550	30 MB	65 W
	12900TE		1.1	4.8		1.0	3.6				35 W
Core i7	12700E		2.1		4 (4)	1.6			300–1500	25 MB	65 W
	12700TE		1.4	4.6		1.0	3.4				35 W
Core i5	12500E	6 (12)	2.9	4.5	300–1450	18 MB	65 W
	12500TE		1.9	4.3	35 W
Core i3	12100E	4 (8)	3.2	4.2	UHD 730	300–1400	12 MB	60 W
	12100TE		2.1	4.0				35 W

Alder Lake-U

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1265UE	2 (4)		4.7	8 (8)		3.5	Iris Xe (96 EU)	?–1250	12 MB	15 W	55 W
Core i5	1245UE			4.4			3.3	Iris Xe (80 EU)	?–1200
Core i3	1215UE				4 (4)			UHD Graphics (64 EU)	?–1100	10 MB

Alder Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1270PE	4 (8)		4.5	8 (8)		3.3	Iris Xe (96 EU)	?–1350	18 MB	28 W	64 W
Core i5	1250PE			4.4			3.2	Iris Xe (80 EU)	?–1300	12 MB
Core i3	1220PE			4.2	4 (4)		3.1	UHD Graphics (48 EU)	?–1250				Q1 2022

Alder Lake-PS

Common features:

• Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
• All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	12800HL	6 (12)	2.4	4.8	8 (8)	1.8	3.7	Iris Xe (96 EU)	?–1400	24 MB	45 W	65 W	Q3 2022
	12700HL		2.3	4.7		1.7	3.5
	1265UL	2 (4)	1.8	4.8		1.3	2.7		?–1250	12 MB	15 W	28 W
	1255UL		1.7	4.7		1.2	2.6
Core i5	12600HL	4 (8)	2.7	4.5		2.0	3.3	Iris Xe (80 EU)	?–1400	18 MB	45 W	65 W
	12500HL		2.5			1.8
	1245UL	2 (4)	1.6	4.4		1.2	2.5		?–1250	12 MB	15 W	28 W
	1235UL		1.3			1.1			?–1200
Core i3	12300HL	4 (8)	2.0		4 (4)	1.5	3.3	UHD Graphics (48 EU)	?–1400		45 W	65 W
	1215UL	2 (4)	1.2			0.9	2.5	UHD Graphics (64 EU)	?–1100	10 MB	15 W	28 W

Alder Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
• All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 1.25 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	12800HE	6 (12)	2.4	4.6	8 (8)	1.8	3.5	Iris Xe (96 EU)	?–1350	24 MB	45 W	115 W
Core i5	12600HE	4 (8)	2.5	4.5			3.3	Iris Xe (80 EU)	?–1300	18 MB
Core i3	12300HE		1.9	4.3	4 (4)	1.5		UHD Graphics (48 EU)	?–1150	12 MB

Core i (13th gen)

Raptor Lake-S

Common features:

• Socket: LGA 1700.
• All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
• All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
  • E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
• Fabrication process: Intel 7.
• Turbo Boost version is 2.0.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP	Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)
			Base	Turbo		Base	Turbo
Core i9	13900E	8 (16)	1.8	5.2	16 (16)	1.3	4.0	UHD 770	300–1650	36 MB	65 W
	13900TE		1.0	5.0		0.8	3.9				35 W
Core i7	13700E		1.9	5.1	8 (8)	1.3			300–1600	30 MB	65 W
	13700TE		1.1	4.8		0.8	3.6				35 W
Core i5	13500E	6 (12)	2.4	4.6		1.5	3.3		300–1550	24 MB	65 W
	13500TE		1.3	4.5		1.1	3.1				35 W
	13400E		2.4	4.6	4 (4)	1.5	3.3			20 MB	65 W
Core i3	13100E	4 (8)	3.3	4.4	UHD 730	300–1500	12 MB	60 W
	13100TE		2.4	4.1	35 W

Raptor Lake-U

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1365UE	2 (4)	1.7	4.9	8 (8)	1.3	3.7	Iris Xe (96 EU)	?–1300	12 MB	15 W	55 W
Core i5	1345UE		1.4	4.6		1.2	3.4	Iris Xe (80 EU)	?–1250
	1335UE		1.3	4.5		0.9	3.3
Core i3	1315UE		1.2		4 (4)			UHD Graphics (64 EU)	?–1200	10 MB

Raptor Lake-P

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	1370PE	6 (12)	1.9	4.8	8 (8)		3.7	Iris Xe (96 EU)	?–1400	24 MB	28 W	64 W
Core i5	1350PE	4 (8)	1.8	4.6			3.4	Iris Xe (80 EU)		12 MB
	1340PE			4.5			3.3		?–1350
Core i3	1320PE		1.7		4 (4)			UHD Graphics (48 EU)	?–1200

Raptor Lake-H

Common features:

• Socket: BGA 1744.
• All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
• All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• L1 cache:
  • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
• Fabrication process: Intel 7.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core i7	13800HE	6 (12)	2.5	5.0	8 (8)	1.8	4.0	Iris Xe (96 EU)	?–1400	24 MB	45 W	115 W
Core i5	13600HE	4 (8)	2.7	4.8		2.1	3.6	Iris Xe (80 EU)		18 MB
Core i3	13300HE		2.1	4.6	4 (4)	1.9	3.4	UHD Graphics (48 EU)	?–1300	12 MB

Core / Core Ultra 3/5/7/9 (Series 1)

Meteor Lake-PS

Common features:

• Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
• All the CPUs support dual-channel DDR5-5600 RAM.
• All CPU models provide 20 lanes of PCIe 4.0.
• All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
• Includes integrated graphics based on Alchemist architecture.
• L1 cache:
  • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
  • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
• L2 cache:
  • P-cores: 2 MB per core.
  • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
• All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
• Fabrication process: Intel 4 (compute tile).
• Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.

Processor branding	Model	P-core (performance)			E-core (efficiency)			Integrated GPU		Smart Cache	TDP		Release date
		Cores (Threads)	Clock rate (GHz)		Cores (Threads)	Clock rate (GHz)		Model	Clock (MHz)		Base	Max. Turbo
			Base	Turbo		Base	Turbo
Core Ultra 7	165HL	6 (12)	1.4	5.0	8 (8)	0.9	3.8	Intel Arc (8 Xe-cores)	?–2300	24 MB	45 W	115 W
	155HL			4.8					?–2250
	165UL	2 (4)	1.7	4.9		1.2		Intel Graphics (4 Xe-cores)	?–2000	12 MB	15 W	57 W
	155UL			4.8					?–1950
Core Ultra 5	135HL	4 (8)		4.6		1.2	3.6	Intel Arc (8 Xe-cores)	?–2200	18 MB	45 W	115 W
	125HL		1.2	4.5		0.7		Intel Arc (7 Xe-cores)
	135UL	2 (4)	1.6	4.4		1.1		Intel Graphics (4 Xe-cores)	?–1900	12 MB	15 W	57 W
	125UL		1.3	4.3		0.8			?–1850
Core Ultra 3	105UL		1.5	4.2	4 (4)	1.0	3.5	Intel Graphics (3 Xe-cores)	?–1800	10 MB

See also

• List of Intel Pentium M microprocessors
• List of Intel Celeron microprocessors
• List of Intel Pentium processors
• Intel Core
• Intel Core 2
• Comparison of Intel processors
• Enhanced Pentium M (microarchitecture)
• Intel Core (microarchitecture)
• Penryn (microarchitecture)
• Alder Lake (microprocessor)

References

• ATI provides pointer to Intel's 'Allendale', May 23, 2006
• Rumoured prices and specifications for Intel Core 2, May 30, 2006
• TGDaily indicates leaked release dates, July 24, 2006
• Intel to unveil five Merom CPUs in July, paper says as re-reported by DigiTimes, July 17, 2006
• Intel Unveils World's Best Processor, July 27, 2006
• Intel Takes Popular Laptops to 'Extreme' with First-Ever Extreme Edition Mobile Processor; Adds New Desktop Chip, July 16, 2007
• CORE 2 DUO 1333 MHZ STEPPING, July 18, 2007

External links

• Search MDDS Database
• Intel ARK Database
• SSPEC/QDF Reference (Intel)
• Intel® Processor Names, Numbers and Generation List
• Intel CPU Transition Roadmap 2008–2013
• Intel Desktop CPU Roadmap 2004–2011
• Intel Core Solo mobile processor product order code table
• Intel Core Duo mobile processor product order code table
• Intel Core Duo Processor and Core Solo Processor on 65 nm Process Datasheet
• Intel Core Duo Processor and Core Solo Processor on 65 nm Process Specification Update
• Intel Core 2 Duo Processors Technical Documents
• Intel Core i3 desktop processor product order code table
• Intel Core i3 mobile processor product order code table
• Intel Core i5 desktop processor product order code table
• Intel Core i5 mobile processor product order code table
• Intel Core i7 desktop processor product order code table
• Intel Core i7 mobile processor product order code table
• Intel Core i7 desktop processor Extreme Edition product order code table
• Intel Core i7 mobile processor Extreme Edition product order code table
• Intel's Core i7 web page
• Intel's Core i7 Extreme Edition web page
• Intel's Core i7 Processor Numbers
• Intel's Core i7 Extreme Edition Processor Numbers
• Intel Corporation – Processor Price List
• Intel Corporation – Processor Price List
• Intel Core X-series processors

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