| Journal of Thermal Stresses | |
| Abbreviation: | J. Therm. Stress. |
| Discipline: | Materials science |
| Editor: | Martin Ostoja-Starzewski |
| Publisher: | Taylor & Francis |
| History: | 1978–present |
| Frequency: | Monthly |
| Impact: | 3.280 |
| Impact-Year: | 2020 |
| Issn: | 0149-5739 |
| Eissn: | 1521-074X |
| Website: | https://www.tandfonline.com/action/journalInformation?journalCode=uths20 |
The Journal of Thermal Stresses is a monthly peer-reviewed scientific journal covering the theoretical and industrial applications of thermal stresses. It is published by Taylor & Francis. The journal was established in 1978 with Richard B. Hetnarski (Rochester Institute of Technology) as founding editor-in-chief. In July 2018 he was succeeded by Martin Ostoja-Starzewski (University of Illinois at Urbana-Champaign).
The journal is abstracted and indexed in:
According to the Journal Citation Reports, the journal has a 2020 impact factor of 3.28.[2]