| IEEE Transactions on Advanced Packaging | |
| Editor: | Ganesh Subbarayan |
| Discipline: | Multi-chip modules, wafer-scale integration |
| Formernames: | IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing |
| Abbreviation: | IEEE Trans. Adv. Packag. |
| Publisher: | IEEE Components, Packaging, and Manufacturing Technology Society |
| Frequency: | Quarterly |
| History: | 19992010 |
| Impact: | 1.276 |
| Impact-Year: | 2010 |
| Website: | http://ieeexplore.ieee.org/xpl/aboutJournal.jsp?punumber=6040 |
| Oclc: | 39742480 |
| Lccn: | 99111625 |
| Coden: | ITAPFZ |
| Issn: | 1521-3323 |
IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.[1]