IEEE Rao R. Tummala Electronics Packaging Award explained

The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.

The award may be presented to an individual or a team of up to three recipients.

Recipients of this award receive a bronze medal, certificate and an honorarium.

Recipients

Recipients of the award for each year include:

External links

Notes and References

  1. https://web.archive.org/web/20140502003620/http://www.ieee.org/about/news/2012/3may_2012.html Mauro J. Walker, Driver of Microelectronics Production Advancements, to Receive 2012 IEEE Components, Packaging and Manufacturing Technology Award
  2. http://www.nano.gatech.edu/news/release.php?id=5036 Rao Tummala to Receive IEEE CPMT Award
  3. http://technews.tmcnet.com/news/2011/05/19/5521895.htm Rao R. Tummala, Microelectronics Packaging Trailblazer, to Receive 2011 IEEE Components Packaging and Manufacturing Technology Award
  4. http://www.izm.fhg.de/EN/news_events/news/IEEEComponentsPackagingManufacturingTechnologyAward2010.jsp IEEE Components, Packaging & Manufacturing Technology Award 2010
  5. http://www.electroiq.com/articles/ap/2010/06/herbert-reichl-awarded.html Herbert Reichl awarded IEEE CPMT field award for 2010
  6. http://www.electroiq.com/articles/ap/2009/05/harman-receives-ieee-award-for-wire-bonding-improvements.html Harman Receives IEEE Award for Wire Bonding Improvements
  7. http://www.chemistry.gatech.edu/faculty/Wong/ C. P. Wong, Regent's Professor

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