| Latest Release Version: | ver5.2.1029.1122 |
| Latest Release Date: | 2015 |
| Platform: | Windows |
| Language: | English |
| Genre: | Electronic circuit simulation |
| License: | GNU Lesser General Public License 2.1 |
CoolSPICE is a computer-aided design tool developed by CoolCAD Electronics Inc. It is a specialized version of the SPICE (Simulation Program with Integrated Circuit Emphasis) simulation tool that focuses on design and simulation for circuit operation at cryogenic temperatures, circuits operating with Wide-bandgap semiconductors, and simulation of thermal effects on circuit performance.
CoolSPICE was developed from SPICE3f5,[1] a version of Ngspice, both by CoolCAD Electronics, Inc.[2] It is used for modeling standard electronic applications, such as radio frequency and audio circuits, but was created with a focus on modeling and designing circuits functioning at extreme temperatures, meant to range from 4 to 300 Kelvin (abbreviated as K). The software is used for modeling both cryogenic-temperature CMOS circuits and high-power, high-temperature silicon carbide (SiC)-powered Metal Oxide Semiconductor Field Effect Transistor (MOSFET) devices.[3] It's also used to simulate the temperature changes of various electrical components that result from power dissipation during circuit operation.[4]
CoolSPICE simulates electronic circuits operating at cryogenic temperatures intended to range as low as 4 Kelvin, which is the temperature of liquid Helium. The compact models used to carry out these circuit simulations were created for numerous CMOS processes; models were built on BSIM 4 and experimentally verified. BSIM 4 is a predictive MOSFET SPICE model for circuit simulation and CMOS development created by the BSIM Research Group in the Department of Electrical Engineering and Computer Sciences at the University of California, Berkeley.[5] CoolSPICE also has device models for cryogenic temperature operation simulation of NMOS and PMOS from different technologies. The tool reads the net-list files of similar circuit simulation tools, such as Cadence.
CoolSPICE has models for simulating Wide-bandgap semiconductor devices, which include power MOSFETs, SiC BJTs, and GaAs power FETs. The SPICE simulation models for SiC-power MOSFET devices for the software were developed using sub-circuits built around the standard BSIM MOSFET. Power devices have specific behaviors unique to themselves and certain BSIM equations have been modified to account for that factor. The drain-to-gate and drain-to-source capacitance terms were modified to account for the different structures of power MOSFET devices. Due to these various modifications, the new BSIM equations required the introduction of new parameters to the already existing MOSFET parameter sets. The resulting new models with both common BSIM parameters, as well as the newly introduced parameters necessitated by the modifications, are the models used by CoolSPICE for simulations.[6]
CoolSPICE is a software tool that examines how electronic circuits are heated while they are on. As electrical currents pass through circuits, they produce heat (Joule heating) which can make components warm. Fans often help cool the circuits in such cases to prevent them from getting too hot. This heat buildup is practically simulated by CoolSPICE thus enabling engineers to predict temperature changes in their designs. The software packages model heat transfer within both conduction and convection and also incorporate a built-in library for these thermal simulations.